Open AccessA novel method to detect wafer-bonding energy using function fitting
Author(s) -
Jianhan Fan,
Kaiming Yang,
Yu Zhu,
Sen Lu
Publication year - 2021
Publication title -
review of scientific instruments
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.605
H-Index - 165
eISSN - 1089-7623
pISSN - 0034-6748
DOI - 10.1063/5.0066317
Subject(s) - wafer , computer science , energy (signal processing) , function (biology) , reading (process) , identification (biology) , curve fitting , measure (data warehouse) , limiting , materials science , algorithm , mechanical engineering , optoelectronics , data mining , mathematics , machine learning , statistics , botany , evolutionary biology , political science , law , biology , engineering
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