Open AccessProject ameliz: Patterning techniques for copper electroplated metallization on heterojunction solar cells
Author(s) -
Agata Lachowicz,
Gaëlle Andreatta,
Nicolas Blondiaux,
Antonin Faes,
Nicolas Badel,
Juan J. Díaz León,
Christophe Allebé,
Charly Fontaine,
PaulHenri Haumesser,
J. Jourdan,
D. Muñoz,
Maxime Godard,
Maxime Darmon,
Sylvain Nicolay,
Matthieu Despeisse,
Christophe Ballif
Publication year - 2021
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/5.0056227
Subject(s) - monolayer , copper , materials science , heterojunction , copper plating , electroplating , layer (electronics) , chemical engineering , plating (geology) , nanotechnology , optoelectronics , metallurgy , geophysics , geology , engineering
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom