Open AccessEffect of cooling rates on contact angle, joint strength and intermetallic of Sn-9Zn solder alloy
Author(s) -
Ramani Mayappan,
Suezane Kuab Ngilo
Publication year - 2021
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/5.0043379
Subject(s) - intermetallic , materials science , soldering , ultimate tensile strength , alloy , scanning electron microscope , wetting , contact angle , metallurgy , composite material , joint (building) , tensile testing , optical microscope , structural engineering , engineering
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