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A microscopic TEM study of the defect layers in cast-mono crystalline silicon wafers induced by diamond-wire sawing
Author(s) -
Hangfei Li,
Xuegong Yu,
Xiaodong Zhu,
Chuanhong Jin,
Shenglang Zhou,
Deren Yang
Publication year - 2021
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0034896
Subject(s) - materials science , silicon , wafer , diamond , composite material , crystalline silicon , diamond cubic , transmission electron microscopy , brittleness , crystallographic defect , stacking , layer (electronics) , optoelectronics , nanotechnology , crystallography , chemistry , physics , nuclear magnetic resonance

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