Open AccessWettability, microstructure, and tensile properties of Sn– 3.0Ag–0.5Cu solder alloy prepared by reflow oven and susceptor-assisted microwave
Author(s) -
Mardiana Said,
Ahmad Azmin Mohamad
Publication year - 2020
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/5.0015789
Subject(s) - materials science , wetting , soldering , microstructure , ultimate tensile strength , susceptor , intermetallic , composite material , contact angle , metallurgy , alloy , layer (electronics) , epitaxy
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