Open AccessStructure, thermal and electrochemical behavior of lead free solder tin-zinc
Author(s) -
A. D. Trisnadi,
Bambang Soegijono,
A. Sudarmadji,
Winci Firdaus
Publication year - 2020
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/5.0007975
Subject(s) - tin , materials science , soldering , alloy , metallurgy , diffractometer , microstructure , eutectic system , zinc , melting point , polarization (electrochemistry) , scanning electron microscope , composite material , chemistry
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