Open AccessThe role of Ru passivation and doping on the barrier and seed layer properties of Ru-modified TaN for copper interconnects
Author(s) -
Suresh Kondati Natarajan,
CaraLeies,
Michael Nolan
Publication year - 2020
Publication title -
the journal of chemical physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.071
H-Index - 357
eISSN - 1089-7690
pISSN - 0021-9606
DOI - 10.1063/5.0003852
Subject(s) - passivation , barrier layer , copper , doping , layer (electronics) , materials science , optoelectronics , chemical engineering , composite material , metallurgy , engineering
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