Open AccessStudy on precision dicing process of SiC wafer with diamond dicing blades
Author(s) -
Wang Xue,
Zewei Yuan,
Peng Zhuang,
Tianzheng Wu,
Shuang Feng
Publication year - 2021
Publication title -
nanotechnology and precision engineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.232
H-Index - 12
eISSN - 2589-5540
pISSN - 1672-6030
DOI - 10.1063/10.0005152
Subject(s) - wafer dicing , wafer , materials science , blade (archaeology) , diamond , composite material , vibration , mechanical engineering , engineering , optoelectronics , acoustics , physics
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