Open AccessTrends in nondestructive imaging of IC packages
Author(s) -
Thomas M. Moore,
Cheryl Hartfield
Publication year - 1998
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1063/1.56915
Subject(s) - ball grid array , flip chip , acoustic microscopy , nondestructive testing , materials science , integrated circuit packaging , chip , surface mount technology , interconnection , delamination (geology) , acoustics , electronic engineering , computer science , integrated circuit , microscopy , soldering , optoelectronics , engineering , optics , telecommunications , adhesive , composite material , tectonics , biology , paleontology , layer (electronics) , radiology , medicine , physics , subduction
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