Open AccessX-ray photoelectron spectroscopy, depth profiling, and elemental imaging of metal/polyimide interfaces of high density interconnect packages subjected to temperature and humidity
Author(s) -
David R. Jung,
Bola Ibidunni,
Muhammad Ashraf
Publication year - 1998
Language(s) - English
Resource type - Conference proceedings
DOI - 10.1063/1.56892
Subject(s) - x ray photoelectron spectroscopy , materials science , polyimide , ball grid array , polymer , metal , composite material , copper , analytical chemistry (journal) , metallurgy , layer (electronics) , chemical engineering , chemistry , soldering , chromatography , engineering
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