Analytical challenges in next generation packaging/assembly
Author(s) -
Rajen Dias,
Deepak Goyal,
Shalabh Tandon,
Gay Samuelson
Publication year - 1998
Language(s) - Uncategorized
Resource type - Conference proceedings
DOI - 10.1063/1.56847
Subject(s) - interconnection , computer science , electricity generation , reliability engineering , fault detection and isolation , systems engineering , engineering , power (physics) , computer network , physics , quantum mechanics , artificial intelligence , actuator
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