Measurement of the Seebeck coefficient under high pressure by dual heating
Author(s) -
Takashi Yoshino,
Ran Wang,
Hitoshi Gomi,
Yoshihisa Mori
Publication year - 2020
Publication title -
review of scientific instruments
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.605
H-Index - 165
eISSN - 1089-7623
pISSN - 0034-6748
DOI - 10.1063/1.5143525
Subject(s) - seebeck coefficient , thermocouple , thermoelectric effect , materials science , temperature gradient , electrical resistivity and conductivity , thermoelectric materials , wafer , electromotive force , temperature control , temperature measurement , thermal conductivity , analytical chemistry (journal) , optoelectronics , thermodynamics , composite material , electrical engineering , chemistry , physics , chromatography , quantum mechanics , engineering
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