Electrical and optical analysis of a spray coated transparent conductive adhesive for two-terminal silicon based tandem solar cells
Author(s) -
Ulrike Heitmann,
Oliver Höhn,
Hubert Hauser,
Sven Kluska,
Jonas Bartsch,
S. Janz
Publication year - 2019
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5123884
Subject(s) - materials science , electrical conductor , electrical resistivity and conductivity , optoelectronics , coating , silicon , substrate (aquarium) , reflection (computer programming) , adhesive , tandem , composite material , optics , electrical engineering , computer science , oceanography , physics , layer (electronics) , geology , programming language , engineering
This work presents the results of the electrical and optical characterization of a new transparent conductive adhesive (TCA) that combines the techniques of spray pyrolysis and a sol-gel like process. This approach is of particular interest since the adhesive itself forms both the electrical and the mechanical interconnection of the bonded sub-cells. The electrical and optical characterization of the developed TCA shows a minimum connecting resistivity of 17 Ωcm2 and a simulated reflection at the Si-TCA interface of ≈ 20%. By coating both substrate surfaces with a TiO2 anti reflection coating (ARC), the reflectance at the Si-TCA interface was successfully reduced down to 80% of maximum), while additionally reducing the connecting resistivity to 10 Ωcm² or 1 Ωcm2 allows for a further increase to 27.3% and 30.0%, respectively.This work presents the results of the electrical and optical characterization of a new transparent conductive adhesive (TCA) that combines the techniques of spray pyrolysis and a sol-gel like process. This approach is of particular interest since the adhesive itself forms both the electrical and the mechanical interconnection of the bonded sub-cells. The electrical and optical characterization of the developed TCA shows a minimum connecting resistivity of 17 Ωcm2 and a simulated reflection at the Si-TCA interface of ≈ 20%. By coating both substrate surfaces with a TiO2 anti reflection coating (ARC), the reflectance at the Si-TCA interface was successfully reduced down to <5%. The efficiency potential of a glued dual junction device was simulated in dependence of the electrical and optical properties of the TCA. The reported values of 17 Ωcm2 connecting resistivity and 20% reflection limit the device efficiency to 22.3% (71% of the maximum achievable efficiency). Reducing the reflection to below 5%, as pra...
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