Open AccessInfluence of cell packaging and design parameters on thermo-mechanical reliability of fingers in crystalline silicon photovoltaic modules
Author(s) -
Sagarika Kumar,
Rajesh Gupta
Publication year - 2019
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5123870
Subject(s) - materials science , soldering , temperature cycling , wafer , crystalline silicon , photovoltaic system , reliability (semiconductor) , layer (electronics) , composite material , silicon , interconnection , ribbon , finite element method , optoelectronics , thermal , structural engineering , electrical engineering , computer science , computer network , power (physics) , physics , quantum mechanics , meteorology , engineering
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