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Overlap modules: A unique cell layup using smart wire connection technology
Author(s) -
P. Papet,
Simon Hänni,
L. Andreetta,
Till Kossler,
D. Lachenal,
B. Legradic,
D.L. Bätzner,
W. Frammelsberger,
Robert Kramer,
Niels Ramsing Holm,
Bénédicte Bonnet-Eymard,
B. Strahm
Publication year - 2019
Publication title -
aip conference proceedings
Language(s) - Uncategorized
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5123867
Subject(s) - interconnection , computer science , reflector (photography) , connection (principal bundle) , string (physics) , electrical engineering , electronic engineering , embedded system , engineering , mechanical engineering , telecommunications , optics , light source , physics , quantum mechanics

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