Open AccessThermal transport in model copper-polyethylene interfaces
Author(s) -
Yuanyang Ren,
Kai Wu,
D. F. Coker,
N. Quirke
Publication year - 2019
Publication title -
the journal of chemical physics
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 1.071
H-Index - 357
eISSN - 1089-7690
pISSN - 0021-9606
DOI - 10.1063/1.5123616
Subject(s) - materials science , thermal conduction , thermal conductivity , condensed matter physics , polyethylene , phonon , amorphous solid , chemical physics , copper , interfacial thermal resistance , polymer , phase (matter) , composite material , thermal , thermodynamics , thermal resistance , chemistry , crystallography , physics , metallurgy , organic chemistry
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