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An analytical model for predicting residual stresses in multiple layers by plasma cladding process
Author(s) -
Yajie Chu,
Benxing Hao,
Zhenhong Li,
Jun Zhu,
Xiunan He
Publication year - 2019
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5115559
Subject(s) - residual stress , materials science , cladding (metalworking) , thermal expansion , composite material , curvature , residual , substrate (aquarium) , plasma , layer (electronics) , geometry , oceanography , mathematics , physics , algorithm , quantum mechanics , computer science , geology

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