Enhancing the interfacial thermal conduction of the graphene sheets via chemical bond–bond connections
Author(s) -
Min-Shan Li,
Kaixuan Chen,
Yuan-Xiang Fu,
Dong-Chuan Mo,
Shu-Shen Lyu
Publication year - 2019
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5113973
Subject(s) - graphene , thermal conductivity , van der waals force , thermal conduction , materials science , chemical bond , chemical physics , heat transfer , nanotechnology , conductance , thermal , work (physics) , oxide , thermodynamics , chemistry , condensed matter physics , molecule , composite material , organic chemistry , physics , metallurgy
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