Open AccessInverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves
Author(s) -
Daniel Pereira,
Pierre Bélanger
Publication year - 2019
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5099772
Subject(s) - materials science , shear modulus , adhesive , finite element method , modulus , inverse , shear (geology) , ultrasonic sensor , composite material , stiffness , lamb waves , pure shear , acoustics , structural engineering , surface wave , optics , geometry , simple shear , physics , mathematics , layer (electronics) , engineering
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