Open AccessLow temperature Cu bonding with large tolerance of surface oxidation
Author(s) -
Hui Ren,
Fengwen Mu,
Seongbin Shin,
Lei Liu,
Guisheng Zou,
Tadatomo Suga
Publication year - 2019
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5097382
Subject(s) - microstructure , materials science , formic acid , oxide , oxidation process , chemical engineering , layer (electronics) , metallurgy , nanotechnology , chemistry , organic chemistry , engineering
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