Open AccessErratum: “Influence of the thickness of a nanometric copper interlayer on Au/dielectric thermal boundary conductance” [J. Appl. Phys. 124, 105304 (2018)]
Author(s) -
Maïté Blank,
L. Weber
Publication year - 2019
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.5096856
Subject(s) - dielectric , copper , condensed matter physics , conductance , materials science , thermal conductivity , thermal , boundary (topology) , thermodynamics , composite material , physics , optoelectronics , metallurgy , mathematics , mathematical analysis
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