Open AccessApplication of conformal cooling to reduce cooling time and warpage of a U-shaped plate
Author(s) -
Chun-Ting Lu,
Chun-Hsein Chen,
ShiChang Tseng
Publication year - 2019
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5088265
Subject(s) - conformal map , baffle , water cooling , materials science , mechanical engineering , mold , conformal coating , mechanics , engineering , composite material , geometry , physics , mathematics , coating
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