Past, present, and future of InP-based photonic integration | Zendy

M.K. Smit | Zendy; Kevin Williams | Zendy; Jos van der Tol | Zendy

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Past, present, and future of InP-based photonic integration

Author(s) -

M.K. Smit,

Kevin Williams,

Jos van der Tol

Publication year - 2019

Publication title -

apl photonics

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 2.094

H-Index - 34

ISSN - 2378-0967

DOI - 10.1063/1.5087862

Subject(s) - photonics , indium phosphide , photonic integrated circuit , microelectronics , bandwidth (computing) , silicon photonics , electronics , computer science , integrated circuit , telecommunications , engineering , electronic engineering , engineering physics , electrical engineering , nanotechnology , optoelectronics , materials science , gallium arsenide

The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. PICs offer compelling performance advances in terms of precision, bandwidth, and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are Indium Phosphide (InP)-based monolithic integration and Silicon Photonics. In this perspective paper, we will describe the current status and future developments of InP-based generic integration platforms.

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