Open AccessThe optimization of ultrasonic power and bonding time for thermosonic flip chip bonding
Author(s) -
M. R. Lim,
Zaliman Sauli,
H. Aris,
Vithyacharan Retnasamy,
Jeffery C. C. Lo,
K. Muniandy,
Navas Khan,
Chee S. Foong
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5080907
Subject(s) - flip chip , materials science , interconnection , wire bonding , die (integrated circuit) , ultrasonic sensor , chip , composite material , computer science , acoustics , layer (electronics) , nanotechnology , telecommunications , adhesive , physics
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