Open AccessThermosonic vs thermocompression flip chip bonding for low cost system in package
Author(s) -
M. R. Lim,
Zaliman Sauli,
H. Aris,
Vithyacharan Retnasamy,
Jeffery C. C. Lo,
K. Muniandy,
Navas Khan,
Chee S. Foong
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5080906
Subject(s) - flip chip , interconnection , soldering , coining (mint) , materials science , integrated circuit packaging , chip , system in package , electronic packaging , electronic engineering , composite material , optoelectronics , computer science , engineering , integrated circuit , adhesive , metallurgy , computer network , layer (electronics) , telecommunications
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