Open AccessModal analysis and experimental testing for PCBA
Author(s) -
Wei Su,
Renhuai Liu,
Zhiyuan He,
Junhua Zhu
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5075692
Subject(s) - modal , modal analysis , modal testing , vibration , finite element method , reliability (semiconductor) , modal analysis using fem , structural engineering , computer science , mode (computer interface) , normal mode , acoustics , engineering , materials science , physics , power (physics) , quantum mechanics , polymer chemistry , operating system
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