Open AccessTransient thermal simulation and thermal testing for PCBA control system
Author(s) -
Wei Su,
Renhuai Liu,
Zhiyuan He,
Junhua Zhu
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5075673
Subject(s) - transient (computer programming) , finite element method , thermal , thermal analysis , materials science , stress (linguistics) , printed circuit board , transient analysis , mechanical engineering , transient response , structural engineering , nuclear engineering , engineering , mechanics , computer science , electrical engineering , physics , thermodynamics , operating system , linguistics , philosophy
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