Open AccessThe effect of Ni addition on Cu-Sn intermetallic growth rate values in the SAC solder
Author(s) -
Ramani Mayappan,
Nurunajah Ab Ghani,
I. Yahya
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5066972
Subject(s) - soldering , intermetallic , materials science , metallurgy , sintering , substrate (aquarium) , microelectronics , copper , powder metallurgy , dip soldering , wave soldering , optoelectronics , oceanography , alloy , geology
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