Open AccessMetal contamination of silicon wafers in diamond wire sawing processes depending on the sawing parameters
Author(s) -
Lydia Lottspeich,
Petra Müller,
Thomas A. Kaden
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5049342
Subject(s) - wafer , silicon , materials science , diamond , metallurgy , impurity , carrier lifetime , metal , coating , layer (electronics) , nickel , composite material , optoelectronics , chemistry , organic chemistry
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