Open AccessAnalysis of structured wire wafering processes to predict optimized process settings by varying particle size and wire diameter
Author(s) -
R. Koepge,
Kjell Buehler,
Felix Kaule,
Johannes Zeh,
Stephan Schoenfelder,
O. Anspach
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5049340
Subject(s) - wafer , slurry , materials science , silicon , particle size , microelectronics , silicon carbide , particle (ecology) , diamond , composite material , metallurgy , engineering drawing , mechanical engineering , optoelectronics , engineering , oceanography , chemical engineering , geology
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