Full size IBC module based on industrially processed 95 µm thin cells with a CtM power loss < 1%
Author(s) -
P.M. Sommeling,
Jan Kroon,
N. Guillevin,
L.A.G. Okel,
Carol Olson
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5049304
Subject(s) - wafer , materials science , interconnection , optoelectronics , thin film , electrical engineering , process engineering , nanotechnology , computer science , engineering , computer network
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