Open AccessPreparation and characterization of low temperature curing conductive silver paste for screen printing
Author(s) -
Zeming Fang,
Zhidan Lin,
Peng Zhang
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5048751
Subject(s) - materials science , curing (chemistry) , adhesive , screen printing , electrical conductor , composite material , epoxy , conductivity , polyethylene glycol , chemical engineering , chemistry , layer (electronics) , engineering
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