Open AccessConstitutive behaviour and life evaluation of solder joint under the multi-field loadings
Author(s) -
Xu Long,
YongChao Liu,
Yao Yao,
Fengrui Jia,
Cheng Zhou,
Yonghui Fu,
Yanpei Wu
Publication year - 2018
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5044446
Subject(s) - soldering , materials science , joint (building) , finite element method , service life , plasticity , composite material , ultimate tensile strength , stress (linguistics) , constitutive equation , parametric statistics , structural engineering , linguistics , philosophy , statistics , mathematics , engineering
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