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Modeling of heat transfer in compacted machining chips during friction consolidation process
Author(s) -
N.M. Abbas,
Xiaomin Deng,
Xiao Li,
A. P. Reynolds
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5034335
Subject(s) - consolidation (business) , machining , materials science , extrusion , compaction , thermocouple , heat transfer , chip formation , mechanical engineering , composite material , metallurgy , mechanics , tool wear , engineering , business , physics , accounting

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