Open AccessThermal analysis of epidermal electronic devices integrated with human skin considering the effects of interfacial thermal resistance
Author(s) -
Yuhang Li,
Jianpeng Zhang,
Yufeng Xing,
Jizhou Song
Publication year - 2018
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5029505
Subject(s) - finite element method , materials science , human skin , thermal , heat transfer , thermal analysis , thermal resistance , thermal transfer , coupling (piping) , optoelectronics , composite material , biomedical engineering , mechanics , structural engineering , thermodynamics , layer (electronics) , engineering , physics , biology , genetics
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