Perspective: New process technologies required for future devices and scaling
Author(s) -
Robert D. Clark,
Kandabara Tapily,
K.H. Yu,
Takahiro Hakamata,
Steven Consiglio,
David O’Meara,
Cory S. Wajda,
Jeffrey Smith,
G. J. Leusink
Publication year - 2018
Publication title -
apl materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.571
H-Index - 60
ISSN - 2166-532X
DOI - 10.1063/1.5026805
Subject(s) - scaling , emerging technologies , process (computing) , perspective (graphical) , computer science , nanotechnology , semiconductor device , materials science , engineering physics , systems engineering , engineering , geometry , mathematics , layer (electronics) , artificial intelligence , operating system
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