Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes | Zendy

Olivier Dalverny | Zendy; Joël Alexis | Zendy

Open Access

Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes

Author(s) -

Olivier Dalverny,

Joël Alexis

Publication year - 2018

Publication title -

aip conference proceedings

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.177

H-Index - 75

eISSN - 1551-7616

pISSN - 0094-243X

DOI - 10.1063/1.5024159

Subject(s) - dimensioning , materials science , automotive industry , characterization (materials science) , mechanical engineering , field (mathematics) , dissipation , thermal management of electronic devices and systems , thermal expansion , constraint (computer aided design) , electronic component , electronic packaging , temperature cycling , computer science , thermal , engineering , nanotechnology , composite material , aerospace engineering , physics , mathematics , meteorology , pure mathematics , thermodynamics

This article deals with thermo-mechanical behavior of power electronic modules used in several transportation applications as railway, aeronautic or automotive systems. Due to a multi-layered structures, involving different materials with a large variation of coefficient of thermal expansion, temperature variations originated from active or passive cycling (respectively from die dissipation or environmental constraint) induces strain and stresses field variations, giving fatigue phenomenon of the system. The analysis of the behavior of these systems and their dimensioning require the implementation of complex modeling strategies by both the multi-physical and the multi-scale character of the power modules. In this paper we present some solutions for studying the thermomechanical behavior of brazed assemblies as well as taking into account the interfaces represented by the numerous metallizations involved in the process assembly.

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