Improvement of adhesion of hydrogen-free DLC film by employing an interlayer of tungsten carbide | Zendy

Ryo Isono | Zendy; Tsuyoshi Tanimoto | Zendy; Yushi Iijima | Zendy; Sholihatta Aziz Kusumawan | Zendy; Toru Harigai | Zendy; Yoshiyuki Suda | Zendy; Hirofumi Takikawa | Zendy; Masao Kamiya | Zendy; Satoru Kaneko | Zendy; Shinsuke Kunitsugu | Zendy; Makoto Taki | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

Improvement of adhesion of hydrogen-free DLC film by employing an interlayer of tungsten carbide

Author(s) -

Ryo Isono,

Tsuyoshi Tanimoto,

Yushi Iijima,

Sholihatta Aziz Kusumawan,

Toru Harigai,

Yoshiyuki Suda,

Hirofumi Takikawa,

Masao Kamiya,

Satoru Kaneko,

Shinsuke Kunitsugu,

Makoto Taki

Publication year - 2018

Publication title -

aip conference proceedings

Language(s) - English

Resource type - Conference proceedings

SCImago Journal Rank - 0.177

H-Index - 75

eISSN - 1551-7616

pISSN - 0094-243X

DOI - 10.1063/1.5021932

Subject(s) - materials science , tungsten carbide , diamond like carbon , layer (electronics) , adhesion , tungsten , cathode , composite material , carbide , carbon film , substrate (aquarium) , carbon fibers , thin film , nanotechnology , metallurgy , composite number , chemistry , oceanography , geology

Materials with poor adhesion present a problem for the application of diamond-like carbon (DLC) films. As a method for solving this problem, there is a technique that deposits an interlayer of metal between the DLC film and substrate. A tungsten carbide film (W-C film) is used as the interlayer. In this study, the effect of introducing the W-C interlayer on the adhesion of the DLC film was investigated. The W-C films were deposited using two types of cemented tungsten carbides (WCs) as the cathode, one containing Co (WC-Co) and the other containing Ti (WC-Ti), as a binder for forming the cathode shape. It is necessary to control the film thickness of the interlayer to introduce the interlayer to the DLC film. The film thickness control of W-C films became possible by using a discharge counter. DLC films were deposited using a bias voltage of -100 V. The film thicknesses of the W-C interlayer and DLC film at the time of investigating adhesion were 30 nm and 300 nm, respectively. The result of the tape-peel...

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research