Open AccessMechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation
Author(s) -
Zhiwei Zhang,
Pei Chen,
Fei Qin,
Tong An,
Huiping Yu
Publication year - 2018
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5021654
Subject(s) - silicon , materials science , wafer , grinding , layer (electronics) , ultimate tensile strength , composite material , nanotechnology , optoelectronics
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