Copper electroforming service at Laboratorio Subterráneo de Canfranc
Author(s) -
S. Borjabad,
J. Amaré,
I. Bandac,
M. L. di Vacri,
Aldo Ianni,
S. Nisi
Publication year - 2018
Publication title -
aip conference proceedings
Language(s) - Uncategorized
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5018987
Subject(s) - electroforming , copper , service (business) , metallurgy , materials science , work (physics) , computer science , engineering , mechanical engineering , nanotechnology , economy , layer (electronics) , economics
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