Open AccessComputer-aided analysis of cutting processes for brittle materials
Author(s) -
A. I. Ogorodnikov,
И. Н. Тихонов
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5017334
Subject(s) - wafer dicing , scratch , brittleness , materials science , wafer , finite element method , mechanical engineering , diamond turning , deformation (meteorology) , parametric statistics , stress (linguistics) , structural engineering , engineering drawing , computer science , engineering , machining , composite material , optoelectronics , linguistics , statistics , philosophy , mathematics
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