Open AccessThe thermal analysis study of 3D bare chip laminated packaging structure
Author(s) -
Bangze Huang,
Zhaohua Wu
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5005256
Subject(s) - flip chip , interconnection , materials science , thermal resistance , chip , thermal conductivity , junction temperature , composite material , thermal conduction , thermal , thermal copper pillar bump , die (integrated circuit) , electronic packaging , optoelectronics , layer (electronics) , electrical engineering , nanotechnology , computer science , thermodynamics , engineering , telecommunications , adhesive , physics
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