Open AccessThe handling of thin substrates and its potential for new architectures in multi-junction solar cells technology
Author(s) -
Clément Colin,
Abdelatif Jaouad,
Maxime Dar,
Mathieu de Lafontaine,
Maïté Volatier,
Abderraouf Boucherif,
Richard Arès,
S. Fafard,
Vincent Aimez
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.5001423
Subject(s) - fabrication , solar cell , materials science , wafer , soldering , optoelectronics , interconnection , process (computing) , adhesive , wafer bonding , thin film solar cell , thin film , nanotechnology , computer science , layer (electronics) , composite material , telecommunications , medicine , alternative medicine , pathology , operating system
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