Open AccessThe effect of graphene on the intermetallic and joint strength of Sn-3.5Ag lead-free solder
Author(s) -
Ramani Mayappan,
Amirah Salleh,
Jeyashelly Andas
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4999878
Subject(s) - intermetallic , soldering , materials science , lead (geology) , joint (building) , graphene , metallurgy , structural engineering , nanotechnology , alloy , engineering , geology , geomorphology
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