Open AccessEffects of plasma pretreatment on the process of self-forming Cu–Mn alloy barriers for Cu interconnects
Author(s) -
Jae Hyung Park,
Dong-Suk Han,
Kyoung-Deok Kim,
JongWan Park
Publication year - 2018
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4993051
Subject(s) - materials science , x ray photoelectron spectroscopy , alloy , annealing (glass) , plasma , transmission electron microscopy , analytical chemistry (journal) , dielectric , plasma cleaning , electrical resistivity and conductivity , forming gas , barrier layer , chemical engineering , layer (electronics) , composite material , chemistry , nanotechnology , physics , optoelectronics , chromatography , quantum mechanics , engineering , electrical engineering
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