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This paper investigated the effect of temperature and pressure on the microstructure and electrical behavior of compression molded and mechanically blended polymer composites. Poly (methyl methacrylate) (PMMA) and antimony tin oxide (ATO) were used as the matrix and conductive filler respectively and the composition was varied from 0 to 1.75 ATO vol %. Mixtures of the two precursor materials were compression molded at temperatures ranging from 150 to 190 °C and pressures ranging from 12 to 50 MPa. It was found that a segregated network microstructure was formed in all cases but that the distribution of the conductive ATO fillers varied as a function of the compression molding temperature and pressure used. The thickness of the specimens, determined by the amount of precursor materials and pressure used during compression molding, was also found to affect the resulting microstructure and concomitant properties. The electrical conductivity of these polymer matrix composites can be increased by up to 2 orders of magnitude by decreasing the processing temperature, while maintaining the processing pressure and the filler concentration constant. On the other hand, the flexibility of PMCs can be improved by increasing the processing temperature. For the compositions evaluated, the maximum electrical conductivity obtained was 5 x 10-3 S/m (about three orders of magnitude lower than the conductivity of the filler). Finite element simulations were used to model this microstructure-driven phase segregated percolation behavior. COMSOL Multiphysics® was used to calculate the electric potential and current density distribution in a 3D geometry. There was good agreement between the experimental and simulation results

aip advances

Fabrication and simulation of semi-transparent and flexible PMMA/ATO conductive nanocomposites obtained by compression molding at different temperatures and pressures