Impurity gettering effect of atomic layer deposited aluminium oxide films on silicon wafers

We present experimental evidence for the impurity gettering effect of atomic layer deposited aluminium oxide (Al2O3) films on silicon wafers, during typical surface passivation activation at 425 °C. Iron was used as a model impurity in silicon to study the gettering effects. Dissolved iron concentrations were determined by carrier lifetime measurements, allowing the iron loss kinetics in silicon wafers with Al2O3 coatings to be monitored during annealing. The redistribution of iron to the surface layers and the sub-surface regions was examined by secondary ion mass spectrometry depth profiling. The results show that the atomic layer deposited Al2O3 films generate a strong gettering effect, removing 50% of the iron after 30 min at 425 °C for a 160-μm thick silicon wafer. The iron reduction process is largely diffusion-limited in the initial stages. The gettering effect is caused by the accumulation of iron at the Al2O3/Si interface.