Open AccessMicrostructure and mechanical properties of lead-free Sn-Cu-Ni composite solder paste reinforced with silicon (Si) particles
Author(s) -
Rita Mohd Said,
M.A.A. Mohd Salleh,
Mohd Izrul Izwan Ramli,
Norainiza Saud,
Mohd Mustafa Al Bakri Abdullah,
Andrei Victor Sandu
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4981851
Subject(s) - microstructure , soldering , materials science , composite number , shear strength (soil) , composite material , solder paste , metallurgy , silicon , joint (building) , environmental science , soil science , soil water , architectural engineering , engineering
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