Open AccessThermal and mechanical properties of Sn-Cu-Ni-XSiC composite solder
Author(s) -
Mohd Izrul Izwan Ramli,
M.A.A. Mohd Salleh,
Rita Mohd Said,
Norainiza Saud
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4981849
Subject(s) - soldering , materials science , composite number , composite material , ceramic , dimple , shear strength (soil) , metallurgy , alloy , solder paste , environmental science , soil science , soil water
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