Open AccessMicrostructural and phase analysis of Sn-Cu-Ni-XSiC composite solder
Author(s) -
Mohd Izrul Izwan Ramli,
M.A.A. Mohd Salleh,
Mohd Mustafa Al Bakri Abdullah,
Rita Mohd Said,
Andrei Victor Sandu,
Norainiza Saud
Publication year - 2017
Publication title -
aip conference proceedings
Language(s) - English
Resource type - Conference proceedings
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.4981848
Subject(s) - soldering , materials science , microstructure , composite number , metallurgy , alloy , ceramic , phase (matter) , powder metallurgy , grain boundary , grain size , tin , solder paste , composite material , chemistry , organic chemistry
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